Grouped element transmission channel link with pedestal aspects

ABSTRACT

A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.

BACKGROUND OF THE INVENTION

The present invention pertains to multi-circuit electronic communicationsystems, and more particularly, to a dedicated transmission channelstructure for use in such systems.

Various means of electronic transmission are known in the art. Most, ifnot all of these means suffer from inherent speed limitations, such asboth the upper frequency limit and the actual time a signal requires tomove from one point to another within the system, which is commonlyreferred to as propagation delay. They simply are limited in theirelectronic performance primarily by their structure, and secondarily bytheir material composition. One traditional approach utilizes conductivepins, such as those found in an edge card connector, as such asillustrated in FIG. 1. In this type of structure a plurality ofconductive pins, or terminals 20 are arranged within a plastic housing21 and this arrangement provides operational speeds of about 800 to 900MHz. An improvement upon this standard structure is represented by edgecard connectors that may be known in the art as “Hi-Spec” and which areillustrated in FIG. 2, in which the system includes large groundcontacts 25 and small signal contacts 26 disposed within an insulativeconnector housing 27. The signal contacts in these structures are notdifferential signal contacts, but are merely single-ended signal,meaning that every signal contact is flanked by a ground contact. Theoperational speeds for this type of system are believed to be about 2.3Ghz.

Yet another improvement in this field is referred to a “triad” or“triple” connector in which conductive terminals are disposed within aplastic housing 28 in a triangular pattern, and the terminals include alarge ground terminal 29, and two smaller differential signal terminals30, as illustrated in FIG. 3, and, as described in greater detail U.S.Pat. No. 6,280,209. This triad/triple structure has an apparent upperlimit speed of about 4 Ghz. All three of these approaches utilize, inthe most simplest sense, conductive pins in a plastic housing in orderto provide a transmission line for electronic signals.

In each of these type constructions, it is desired to maintain adedicated transmission line through the entire delivery path of thesystem, including through the circuit board(s), the mating interface andthe source and load of the system. It is difficult to achieve thedesired uniformity within the system when the transmission system isconstructed from individual pins. Discrete point-to-point connectionsare used in these connectors for signal, ground and power. Each of theseconductors was designed as either a conductor or a means of providingelectrical continuity and usually did not take into account transmissionline effects. Most of the conductors were designed as a standardpinfield so that all the pins, or terminals, were identical, regardlessof their designated electrical function and the pins were furtherarranged at a standard pitch, material type and length. Althoughsatisfactory in performance at low operating speeds, at high operationalspeeds, these systems would consider the conductors as discontinuitiesin the system that affect the operation and speed thereof

Many return signal terminals or pins in these systems were commoned tothe same ground conductor, and thus created a high signal to groundratio, which did not lend themselves to high speed signal transmissionbecause large current loops are forced between the signals and theground, which loops reduce the bandwidth and increase the crosstalk ofthe system, thereby possibly degrading the system performance.

Bandwidth (“BW”) is proportional to √1LC, where L is the inductance ofthe system components, C is the capacitance of the system components andBW is the bandwidth. The inductive and capacitive components of thesignal delivery system work to reduce the bandwidth of the system, evenin totally homogeneous systems without discontinuities. These inductiveand capacitive components can be minimized by reducing the overall pathlength through the system, primarily through limiting the area of thecurrent path through the system and reducing the total plate area of thesystem elements. However, as the transmission frequency increases, thereduction in size creates its own problem in that the effective physicallength is reduced to rather small sizes. High frequencies in the 10 Ghzrange and above render most of the calculated system path lengthsunacceptable.

In addition to aggregate inductance and capacitance across the systembeing limiting performance factors, any non-homogeneous geometricaland/or material transitions create discontinuities. Using 2.5 Ghz as aminimum cutoff frequency in a low voltage differential signal systemoperating at around 12.5 Gigabits per second (Gbps), the use of adielectric with a dielectric constant of about 3.8 will yield a criticalpath length of about 0.24 inches (6.1 mm), over which lengthdiscontinuities may be tolerated. This dimension renders impracticablethe ability of one to construct a system that includes a source,transmission load and load within the given quarter-inch. It can thus beseen that the evolution of electronic transmission structures haveprogressed from uniform structured pin arrangements to functionallydedicated pins arrangements to attempted unitary structured interfaces,yet the path length and other factors still limit these structures.

In order to obtain an effective structure, one must maintain a constantand dedicated transmission line over the entire delivery path: from thesource, through the interface and to the load. This would include thematable interconnects and printed circuit boards. This is very difficultto achieve when the delivery system is constructed from individual,conductive pins designed to interconnect with other individualconductive pins because of potential required changes in the size, shapeand position of the pins/terminals with respect to each other. Forexample, in a right angle connector, the relationship between the rowsof pins/terminals change in both the length and the electrical coupling.High speed interconnect design principles that include all areas betweenthe source and load of the system including printed circuit boards,board connectors and cable assemblies are being used in transmissionsystems with sources of up to 2.5 Gbps. One such principle is theprinciple of ground by design which provides added performance over astandard pin field in that coupling is enhanced between the signal andground paths and single-ended operation is complimented. Anotherprinciple being used in such systems includes impedance tuning tominimize discontinuities. Yet another design principle is pinoutoptimization where signal and return paths are assigned to specific pinsin the pin field to maximize the performance.

These type of systems all are limited with respect to attaining thecritical path lengths mentioned above. The present invention is directedto an improved transmission or delivery system that overcomes theaforementioned disadvantages and which operates at higher speeds and inwhich the transmission line is incorporated into a pedestal connector.

SUMMARY OF THE INVENTION

The present directed is therefore directed to an improved transmissionstructure that overcomes the aforementioned disadvantages and utilizesgrouped electrically conductive elements to form a unitary mechanicalstructure that provides a complete electronic transmission channel thatis similar in one sense to a fiber optic system. The focus of theinvention is on providing a complete, copper-based electronictransmission channel that may be incorporated into a physical connectorstructure, as opposed to providing individual inductive pins, separableinterfaces with copper conductors, each embedded in the transmissionchannel yielding more predictable electrical performance and greatercontrol of operational characteristics. Such improved systems of thepresent invention are believed to offer operating speeds for digitalsignal transmission of up to 12.5 G at extended path lengths which aregreater than 0.24 inch (6.1 mm).

Accordingly, it is a general object of the present invention to providean engineered waveguide that functions as a grouped element channellink, wherein the link includes a dielectric body portion that is formedinto a connector body and at least two conductive elements disposedthereon in a spaced-apart order along an exterior surface thereof.

Another object of the present invention is to provide a high-speedsignal transmission line channel link having an elongated body portionof a given cross-section throughout its length, the body portion beingformed from a dielectric with a selected dielectric constant, and thelink having, in its most basic structure, two conductive elementsdisposed on the exterior surface thereof, the elements being of similarsize and shape and oriented thereon, in opposition to each other, so asto steer the electrical energy wave traveling through the link byestablishing particular electrical and magnetic fields.

Yet another object of the present invention is to provide a improvedelectrical transmission channel incorporated into a pedestal-styleconnector structure for providing a “stepped” transmission channelbetween two distinct and spaced-apart levels, the connector structureincluding a dielectric substrate, and a plurality of grooves formed inthe substrate, the grooves having opposing sidewalls, the sidewalls ofthe grooves having a conductive material deposited thereon, such as byplating, to form distinct electronic transmission channels within thegrooves.

A still further object of the present invention is to provide apre-engineered wave guide in which at least a pair of conductiveelements are utilized to provide differential signal transmission, i.e.,signal in (“+”) and signal out (“−”), the pair of conductive elementsbeing disposed on the exterior of the dielectric body so as to permitthe establishment of capacitance per length, inductance per length,impedance, attenuation and propagation delay per unit length, andestablishing these pre-determined performance parameters within thechannels formed by the conductive elements.

Yet another object of the present invention is to provide a non-circulartransmission line for high speed applications, which includes anelongated rectangular or square dielectric member having an exteriorsurface with at least four distinct sectors disposed thereon, thedielectric member including a pair of conductive elements aligned witheach other and disposed on two of the sectors, while separated by anintervening sector

A further object of the present invention is to provide one or moregrouped element channel links in the form of high-speed transmissionlines along an elongate body of insulating plastic material with atleast one bend in the elongate body to transfer signals along thegrouped element channel links in both the vertical and the horizontaldirections.

A still further object of the present invention is to provide a frame ofa plastic material that may be selectively plated with metal to defineone or more grouped element channel links along raised elements in theframe by over-molding the plastic frame with a non-plateable plasticmaterial and plating the exposed raised elements of the frame withmetal.

A yet further object of the present invention is to provide one or moregrouped element channel links in the form of high-speed transmissionlines along a pedestal formed of an insulative material with at leastone bend formed in the pedestal in order to transfer signals along thegrouped element channel links in both vertical and the horizontaldirections.

Another object of the present invention is to provide one or moregrouped element channel links in the form of high-speed transmissionlines along an insulative support pedestal or along an elongate body ofinsulating plastic material where the grouped element channel linksinclude a pair of spaced-apart low impedance conductive traces, such asfor ground or power, the spaced-apart conductive traces being separatedby intervening air gaps and the support structure being configured toprovide a trace path in which the traces make at leats one change indirection.

Yet another object of the present invention is to provide one or moregrouped element channel links in the form of high-speed transmissionlines along a pedestal or along an elongate body of insulating plasticmaterial that accommodates both high speed signals along the groupedchannel links and slower speed signals along other conductive tracesalso formed in the pedestal or elongate body.

The present invention accomplishes the above and other objects by virtueof its unique structure. In one principal aspect, the present inventionincludes a transmission line that is formed from a dielectric with apreselected dielectric constant and a preselected cross-sectionalconfiguration. A pair of conductive surfaces are disposed on thedielectric line, or link, and one preferably aligned with each other andseparated from each other. The conductive surfaces serve as wave guidesfor guiding electrical waves along the transmission link.

In another principal aspect of the present invention, the conductiveelements are grouped together as a pair on a single element, thusdefining a unitized wave guide that may be run between and amongsuccessive printed circuit boards and connected thereto withoutdifficulty. The conductive surfaces may be formed by selectivelydepositing conductive material thereon, such as by plating, the exteriorsurface of the dielectric body, or by molding or otherwise attaching anactual conductor to the body. In this manner, the dielectric may beformed with bends and the conductive surfaces that exist on the surfacethereof maintains their spaced apart arrangement of grouped channelconductors through the bends.

In yet another principal aspect of the invention, the exterior of thetransmission line may be covered by a protective outer jacket, orsleeve. The conductive surfaces may be disposed on the dielectric bodyin a balanced arrangement with equal widths, or an unbalancedarrangement with a pair of conductive elements of different widths.Three conductive elements may be disposed on the dielectric body tosupport a differential triple on the transmission line utilizing a pairof differential signal conductors and an associated ground conductor.The number of conductive surfaces is limited only by the size of thedielectric body, and four such discrete conductive elements may be usedto support two different signal channels or a single differential pairwith dual grounds.

In still another principal aspect of the present invention, a unitarytransmission line is formed within one cavity, or a plurality ofselectively-sized metallized cavities formed within a substrate. Thesubstrate is grooved to form the cavities and the sidewalls of thegrooves may be plated with a conductive material. The air gap betweenthe sidewalls of the cavities, or grooves, in this instance, serves asthe dielectric of the transmission channel.

In yet another principal aspect of the present invention, theaforementioned transmission links may be used to carry power. In suchcircumstances, the underlying transmission line will include a grooveddielectric, with a continuous contact region being formed within thegrooves, i.e., covering the sidewalls and bass of the groove. Thecontinuous contact area that is present on these three surfaces for thelength of the groove extends the current carrying capability of thestructure. A ground plane may be utilized to increase capacitivecoupling among the power channels and the ground plane to reduce thesource impedance of the overall structure. The transmission line may beformed with projecting ridges, or lands, that serve to define troughstherebetween. The conductive surfaces are formed in the troughs by wayof a continuous process, such a selective plating so that a continuousplated trough, i.e., two sidewalls and an interconnecting base areformed which extend for the length of the transmission line. Thisincreases the current carrying capability. A high capacitance may thenbe created across the dielectric to reduce the source impedance of thesystem.

The power carrying aspect of the invention may be further supplementedby the forming of high density contact sets within the system. In agrooved transmission line the opposing sidewalls of the grooves may beplated with a conductive material to form continuous contacts thatextend the length of the transmission line and opposite polarity signals(i.e., “+” and “−”) may be carried along the contacts. A plug assemblymay be molded, such as by way of insert molding into the grooves, eitherindividually or as an assembly encompassing two or more such grooves toinsulate and isolate the opposed contact pairs, which will result in anincreased voltage standoff. A conformal coating may also be used toachieve a similar aim.

The transmission lines of the invention may carry both signals and powerand thus may be easily divided into separate signal channels and powerchannels. The signal channels may be made with conductive strips orpaths of a preselected width, while the power channels, in order tocarry high currents, may include either wider strips or an enlarged,continuos conductor strip. The wider strips are enlarged plate areas ascompared to the signal strips and have a high capacitance. The signaland power channels may be separated by a wide, non-conductive area ofthe transmission line that serves as an isolation region. Because theisolation region may be formed during the forming of the underlyingdielectric base, the isolation region may be readily defined to minimizecross-contamination or electrical interference.

In accordance with another aspect of the present invention, and withrespect to an embodiment that pertains to a pedestal-style connector, anover-molded connector may have an elongated frame member formed from amaterial that can be plated with metal to form conductors for carryinghigh-frequency electronic signals. The frame member may be formed from acatalyzed resin with a set of raised ribs formed along at least one sideof the frame member. Preferably, at least some of the channels definedbetween the raised ribs are deeper than the other channels, such thatthe sidewalls of these deeper channels may be plated with metal toprovide conductive channel elements with high-frequency electronicsignal characteristics, much like a waveguide. The ribs may be disposedon both sides of the frame member and run in the elongated direction ofthe frame member. One of the sets of the raised ribs may wrap around oneend of the frame member from the top surface to the bottom surface toterminate near the other set of raised ribs to provide a contact area onthe underside of the frame member. Likewise, the other set of raisedribs may wrap around the other end of the frame member from the bottomside to the top side to provide a second contact area on the top surfaceof the frame member. Preferably, at least one angular bend is providedacross the frame member and across the raised ribs such that the framemember may interface with and conduct electronic signals in both thehorizontal and vertical directions.

The over-molded connector may then be formed by selectively over-moldingthe frame member with an insulative material, such as with anon-catalyzed resin. In this over-molding process, the channels betweenthe raised ribs are filled with the non-catalyzed resin, leaving thetops of the ribs with the catalyzed resin exposed. However, the deeperchannels that are to have their sidewalls plated with metal to form thechannel links are not filled with the insulative resin. These exposedareas of catalyzed resin left after the over-molding process are thenplated with metal. Thus, metallic conductors are formed on the raisedribs and on the sidewalls of the deeper channels. High-frequencydifferential signals may be conducted along these channel elements. Anymetal that accumulates in the bottom of the deeper channels may beremoved by known techniques. Preferably, at least one conductor on araised rib is disposed between each pair of channel elements, with theconductor on the raised rib has a low impedance, such as may be expectedfor a ground or power source. The channel elements will have an air astheir dielectric material and so the differential signals in the channelelements will have a greater affinity for the low impedance conductorslocated adjacently to the channel elements thereby reducing theimpedance of the connector and improving the transmission of thehigh-frequency signals through the over-molded connector. Theover-molded connector may also be fabricated as a pedestal connector.

The present invention also includes the related processes of forming theover-molded connector. Although such over-molding is only the preferredmanner of constructing connectors of the invention. The frame member isfirst molded from a catalyzed resin material with the afore-mentionedcharacteristics, including the plurality of raised ribs disposed alongat least one surface of the frame member with some channels defined bythe raised ribs being of greater depth than other channels. One or moreangular bends may be provided across the frame member and the raised ribto interface with and conduct electronic signals from differentelevations, such as in both the horizontal and vertical directions. Theframe member is then selectively over-molded with an electricallyinsulative compound, such as a non-catalyzed resin, including in thechannels between the ribs, but not in the deeper channels that will beused to form high-frequency channel elements. The top surfaces of theribs and the sidewalls of the deeper channels are next plated withconductive metal to form electrical conductors on the top surfaces ofthe ribs and to form channel elements in the deeper channels.

These and other objects, features and advantages of the presentinvention will be clearly understood through a consideration of thefollowing detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

In the course of this detailed description, the reference will befrequently made to the attached drawings in which:

FIG. 1 is a schematic plan view of the terminating face of aconventional connector;

FIG. 2 is a schematic plan view of an edge card used in a high speedconnector;

FIG. 3 is a schematic elevational view of a high speed connectorutilizing a triad or triple;

FIG. 4 is a perspective view of a grouped element channel linkconstructed in accordance with the principles of the present invention.

FIG. 5 is a schematic end view of the grouped element channel link ofFIG. 4;

FIG. 6 is a perspective view of an alternate embodiment of a groupedelement channel link constructed in accordance with the principles ofthe present invention.

FIG. 7 is a schematic view of a transmission link of the presentinvention used to connect a source with a load having intermediate loadson the transmission link;

FIG. 8 is a schematic view of a connector element utilizing bothconventional contacts “A” and the transmission links “B” of theinvention, with enlarged detail portions at “A” and “B” thereof,illustrating the occurrence of inductance in the respective systems;

FIG. 9 is a perspective view of an alternate construction of a link ofthe invention with a right angle bend formed therein;

FIG. 10 is a schematic view of a transmission line utilizing the linksof the present invention;

FIG. 11 is a perspective view illustrating alternate media compositionsof the links of the invention;

FIG. 12 is a perspective view of an array of different shapes ofdielectric bodies illustrating alternate conductive surfacearrangements;

FIG. 13 is a perspective view of an array of non-circular cross-sectiondielectric bodies that may be used to form links of the invention;

FIG. 14 is a perspective view of another array of non-circularcross-section dielectric bodies suitable for use as links of theinvention;

FIG. 15 is an exploded view of a connector assembly incorporating amultiple element link of the invention;

FIG. 16 is a perspective view of a connector assembly having twoconnector housings interconnected by a transmission link of theinvention;

FIG. 17 is a diagrammatic view of a transmission channel of the presentinvention with two interconnecting blocks formed at opposite ends of thechannel;

FIG. 18 is a perspective view of an array of different dielectric bodiesthat may be used as links of the with different lens characteristics;

FIG. 19 is a perspective view of a multiple transmission link extrusionwith different signal channels formed thereon;

FIG. 20 is a perspective view of a multiple link extrusion used in theinvention;

FIG. 21 is a perspective view of a mating interface used with a discreteone of the transmission links of the invention, in which matinginterface takes the form of a hollow endcap;

FIG. 22 is a rear perspective view of the end cap of FIG. 21,illustrating the center opening thereof that receives the transmissionlink;

FIG. 23 is a frontal perspective view of the end cap of FIG. 21,illustrating the orientation of the exterior contacts;

FIG. 24 is a plan view of a multiple transmission link right angle,curved connector assembly;

FIG. 25 is a perspective view of an alternate construction of one of thetermination ends of the connector assembly, FIG. 26 is a perspectiveview of a connector suitable for use in connecting transmission channellinks of the present invention to a circuit board;

FIG. 27A is a skeletal perspective view of the connector of FIG. 26illustrating the components that make up the connector;

FIG. 27B is a perspective view of the interior contact assembly of theconnector of FIG. 27A, with the sidewalls removed and illustrating thestructure and placement of the coupling staple;

FIG. 28 is an end view of the connector of FIG. 26;

FIGS. 29A-C are end views of other embodiments of transmission channellinks that utilize, in FIG. 29A, the dielectric body of the transmissionchannel for the medium through which coupling is effected, and in FIGS.29B-C, the air spacing between the conductive elements as the mediumthrough which coupling is effected;

FIG. 30 is an end view of an array of transmission channel links of FIG.29C arranged on a mount and illustrating the packing of transmissionchannels that may be obtained with the present invention;

FIG. 31 is a plan view illustrating a right angle configuration of anair dielectric transmission channel similar to those of FIGS. 29A-C;

FIG. 32 is a perspective view of a waveguide assembly constructed inaccordance with the principles of the present invention;

FIG. 33 is a sectional view of the waveguide assembly of FIG. 32, takenalong lines 33-33 thereof;

FIG. 34 is an enlarged detail view of a sectional view of the waveguideassembly of FIG. 32, taken along lines 34-34 thereof;

FIG. 35 is a perspective view of a connector assembly using a groupedchannel transmission element of the invention extending between twocircuit boards and protected by an exterior, protective jacket;

FIG. 36 is a perspective view of a variation in the use of the groupedelement channel links of the invention, illustrating a right angleapplication thereof used to connect two circuit boards together;

FIG. 37 is a perspective view of a high voltage, high densitytransmission line constructed in accordance with the principles of thepresent invention;

FIG. 38 is an end view of the transmission line of FIG. 37;

FIG. 39 is a perspective view of a transmission line of the inventionthat is suitable for use as a low impedance power transmission line;

FIG. 40 is a perspective view of a mixed signal and power transmissionline of the invention extending between two connectors and wherein thesignal and power conductors are separated by a single isolation region;

FIG. 41 is a perspective view of another mixed signal and powertransmission line extending between two connectors and having multipleisolation regions disposed thereon to separate the signal and powerconductors from each other electrically;

FIG. 42 is a perspective view of a frame for a grouped element channellink connector of the “pedestal” type, which may be used between an edgeconnector and a printed circuit board in accordance with the principlesof the present invention;

FIG. 43 is an elevational side view of the frame of the connector ofFIG. 42;

FIG. 44 is a top plan view of the frame of the connector of FIGS. 43 and44;

FIG. 45 is a rear elevational end view of the frame of the connector ofFIGS. 42-44;

FIG. 46 is a cross-sectional view of the connector of FIG. 44, takenalong line 46-46 thereof;

FIG. 47 is the same cross-sectional view as FIG. 46, but oriented as aperspective view;

FIG. 48 is another cross-sectional view of the connector of FIG. 42, andtaken along line 48-48;

FIG. 49 is rear perspective view, taken partially in section, of theconnector of FIGS. 42-48;

FIG. 50 is an enlarged bottom plan view of the connector of FIGS. 42-49;

FIG. 51 is perspective view of the frame of FIGS. 42-49 after the framehas been over-molded with another plastic material in accordance withthe present invention, with certain elements of the frame illustrated inphantom;

FIG. 52 is a perspective view of an alternative embodiment of thegrouped element channel link connector illustrated in FIGS. 42-51, butillustrating another embodiment in which a larger spacing is providedbetween the grouped channel elements;

FIG. 53 is an exploded view of the connector of FIGS. 42-52 used in anapplication in which an edge connector is connected to a printed circuitboard, and wherein the edge connector and printed circuit board are atdifferent elevations;

FIG. 54 is the same view as FIG. 53, but with the connector and itsshielding tray being attached to the printed circuit board, but with thecover and edge connector tray exploded for clarity;

FIG. 55 is a perspective view of another connector frame structureconstructed in accordance with the principles of the present inventionand which is intended for use in an alternate embodiment of theinvention;

FIG. 56 is a perspective view of the alternate embodiment connector, butwith the an outer covering molded over the frame of FIG. 55 and whichmay be mounted on the printed circuit board such as that illustrated inFIGS. 53 and 54;

FIG. 57 is a top plan view of the connector of FIG. 56; and, FIG. 58 isan elevational end view of the connector of FIGS. 56 and 57.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 4 illustrates a grouped element channel link 50 constructed inaccordance with the principles of the present invention. It can be seenthat the link 50 includes an elongated, dielectric body 51, preferably acylindrical filament, that is similar to a length of fiber opticmaterial. It differs therefrom in that the link 50 acts as apre-engineered wave guide and a dedicated transmission media. In thisregard, the body 51 is formed of a dedicated dielectric having aspecific dielectric constant and a plurality of conductive elements 52applied thereto. In FIGS. 4 and 5, the conductive elements 52 areillustrated as elongated extents, or strips, 52 of conductive materialand, as such, they may be traditional copper or precious metal extentshaving a definite cross-section that may be molded or otherwiseattached, such as by adhesive or other means to the dielectric body ofthe link 50. They may also be formed on the exterior surface 55 of thebody 51 such as by a suitable plating process. At least two suchconductors are used on each link, typically are used for signalconveyance of differential signals, such as +0.5 volts and −0.5 volts.The use of such a differential signal arrangement permits us tocharacterize structures of this invention as pre-engineered waveguidesthat are maintained over the entire length of the signal delivery path.The use of the dielectric body 51 provides for the reduction and alsofor preferred coupling to occur within the link. In the simplestembodiment, as illustrated in FIG. 5, the conductive elements aredisposed on two opposing faces, so that the electrical affinity of eachof the conductive elements is for each other through the dielectric bodyupon which they are supported, or in the case of a conductive channel aswill be explained in greater detail to follow and as illustrated inFIGS. 29-30, the conductive elements are disposed on two or moreinterior faces of the cavity/cavities to establish the primary couplingmode across the cavity gap and through an air dielectric. In thismanner, the links of the present invention may be considered as theelectrical equivalent to a fiber optic channel or extent.

As such, the effectiveness of the links of the present invention aredependent upon the guiding and maintenance of digital signals throughthe charnel link. This will include maintaining the integrity of thesignal, controlling the emissions and minimizing loss through the link.The channel links of the present invention contain the electromagneticfields of the signals transmitted therethrough by controlling thematerial of the channel link and the geometries of the system componentsso that preferred field coupling will be provided.

As illustrated better in FIG. 5, the two conductive surfaces 52 arearranged on the dielectric body 51 in opposition to each other. This isrepresentative of a balanced link of the invention where thecircumferential, or arcuate extent C of the conductive surfaces 52 isthe same, as is the circumferential or arcuate extent Cl, of thenon-conductive exterior surfaces 55 of the dielectric body 51. Thislength may be considered to define a gross separation D between theconductive surfaces. As will be explained below, the link may beunbalanced with one of the conductive surfaces having an arc length thatis greater than the other. In instances where the dielectric body andlink are circular, the link may serve as a contact pin and so beutilized in connector applications. This circular cross-sectiondemonstrates the same type of construction as a conventional roundcontact pin.

As illustrated in FIG. 6, the links of the present invention may bemodified to provide not only multiple conductive elements as part of theoverall system transmission media, but may also incorporate a coincidentand coaxial fiber optic wave guide therewithin for the transmission oflight and optical signals. In this regard, the dielectric body 51 iscored to create a central opening 57 through which an optical fiber 58extends. Electrical signals may be transmitted through this link as wellas light signals 60.

FIG. 7 schematically illustrates a transmission line 70 incorporating alink 50 of the present invention that extends between a source 71 and aload 72. The conductive surfaces 52 of the link serve to interconnectthe source and load together, as well as other secondary loads 73intermediate the source and the load. Such secondary loads may be addedto the system to control the impedance through the system. A lineimpedance is established at the source and may be modified by addingsecondary loads to the transmission line.

FIG. 8 illustrates, schematically, the difference between the links ofthe present invention and conventional conductors, which are bothillustrated in a dielectric block 76. Two discrete, conventionalconductors 77 formed from copper or another conductive material extendthrough the block 76. As shown in enlargement “A”, the two discreteconductor presents an open cell structure with a large inductance (L)because of the enlarged current loop. Quite differently, the links ofthe present invention have a smaller inductance (L) at a constantimpedance due to the proximity of the conductive surfaces positioned asthe dielectric body 51. The dimensions of these links 50 can becontrolled in the manufacturing process and extrusion will be thepreferred process of manufacturing with the conductive surfaces beingextended with the dielectric body or separately applied of theextrusion, such as by a selective plating process so that the resultingconstruction is of the plated plastic variety. The volume of thedielectric body 51 and the spacing between conductive elements disposedthereon may be easily controlled in the extrusion process.

As FIG. 9 illustrates, the dielectric body may have a bend 80 forwardtherewith in the form of the 90° right-angle bend illustrated or in anyother angular orientation. The dielectric body 51 and the conductivesurfaces 52 are easily maintained through the bend.

FIG. 10 illustrates a transmission line using the links of theinvention. The link 50 is considered as a transmission cable formed fromone or more single dielectric bodies 51, and one end 82 of it isterminated to a printed circuit board 83. This termination may be directin order to minimize any discontinuity at the circuit board. A shorttransfer link 84 that maintains any discontinuities at a minimum is alsoprovided. These links 84 maintain the grouped aspect of the transmissionlink. Termination interfaces 85 may be provided where the link isterminated to the connector with minimum geometry discontinuity orimpedance discontinuity. In this manner, the grouping of the conductivesurfaces is maintained over the length of the transmission lineresulting in both geometric and electrical uniformity.

FIG. 11 illustrates a variety of different cross-sections of thetransmission links 50 of the invention. In the rightmost link 90, acentral conductor 93 is encircled by a hollow dielectric body 94 whichin turn, supports multiple conductive surfaces 95 that are separated byan intervening space, preferably filled with portions of the dielectricbody 94. This construction is suitable for use in power applicationswhere power is carried by the central conductor. In the middle link 91,the central cover 96 is preferably made of a selected dielectric and hasconductive surfaces 97 supported on it. A protective outer insulativejacket 98 is preferably provided to protect and or insulate the innerlink. The leftmost link 92 has a protective outer jacket 99 thatenclosed a plateable polymeric ring 100 that encircles either aconductive or insulative core 101. Alternatively, one or the elementssurrounding the core or of the link 92 may be filled with air and may bespaced away from an inner member by way of suitable standoffs or thelike.

FIG. 12 illustrates an array of links 110-113 that have their outerregions combined with the dielectric body 51 to form different types oftransmission links. Link 110 has two conductive surfaces 52 a, 52 b ofdifferent arc lengths (i.e., unbalanced) disposed on the outer surfaceof the dielectric body 51 so that the link 110 may provide single endedoperation. Link 111 has two equal spaced and sized (or “balanced”)conductive elements 52 to provide an effective differential signaloperation.

Link 112 has three conductive surfaces 115 to support a differentialtriple link operation of two differential signal conductors 115 a and anassorted ground conductor 115 b. Link 113 has four conductive surfaces116 disposed on its dielectric body 51 in which the conductive surfaces116 may either include two differential signal channels (or pairs) or asingle differential pair with a pair of associated grounds.

FIG. 13 illustrates an array of one-type of non-circular links 120-122that may have square configurations, as with link 120, or rectangularconfigurations, as with links 121-122. The dielectric bodies 51 may beextended with projecting land portions 125 that are plated or otherwisecovered with conductive material. These land portions 125 may be used“key” into connector slots in a manner so that contact between theconnector terminals (not shown) and the conductive faces 125 is easilyeffected.

FIG. 14 illustrates some additional dielectric bodies. One body 130 isshown as convex, which the other two bodies 131, 132 are shown. Acircular cross-section of the dielectric bodies has a tendency toconcentrate the electrical filed strength at the corners of theconductive surfaces, while a slightly convex form as shown for body 131,has a tendency to concentrate the field strength evenly, resulting in alower and greater convexity, as illustrated in dielectric 132 may havebeneficial cross talk reduction aspects because it focuses theelectrical field inwardly.

Importantly, the transmission link may be formed as a single extrusion200 (FIGS. 15-16) carrying multiple signal channels thereupon, with eachsuch channel including a pair of conductive surface 202-203. Theseconductive surfaces 202, 203 are separated from each other byintervening body 204 that supports them, as well as web portions 205that interconnect them together. This extrusion 200 may be used as partof an overall connector assembly 220, where the extrusion is receivedinto a complementary shaped opening 210 formed in a connector housing211. The inner walls of the openings 210 may be selectively plated, orcontacts 212 may be inserted into the housing 211 to contact theconductive surfaces and provide, if necessary, surface mount or throughhole tail portions.

FIG. 17 illustrates the arrangement of two transmission channels 50arranged as illustrated and terminated at one end to a connector block180 and passing through a right angle block 182 that includes a seriesof right angle passages 183 formed therein which receive thetransmission channel links as shown. In arrangements such as that shownin FIG, 17, it will be understood that the transmission channel linksmay be fabricated in a continuous manufacturing process, such as byextrusion, and each such channel may be manufactured with intrinsic orintegrated conductive elements 52. In the manufacturing of theseelements, the geometry of the transmission channel itself may becontrolled, as well as the spacing and positioning of the conductiveelements upon the dielectric bodies so that the transmission channelswill perform as consistent and unitary electronic waveguides which willsupport a single channel or “lane” of signal (communication) traffic.Because the dielectric bodies of the transmission channel links may bemade rather flexible, the systems of the invention are readilyconformable to various pathways over extended lengths withoutsignificantly sacrificing the electrical performance of the system. Theone connector endblock 180 may maintain the transmission channels in avertical alignment, while the block 182 may maintain the ends of thetransmission channel links in a right angle orientation for terminationto other components.

FIG. 18 illustrates a set of convex dielectric blocks or bodies 300-302in which separation distance L varies and the curve 305 of the exteriorsurfaces 306 of the blocks raises among the links 300-302. In thismanner, it should be understood that the shapes of the bodies may bechosen to provide different lens characteristics.

FIG. 19 illustrates a multiple channel extrusion 400 with a series ofdielectric bodies or blocks 401 interconnected by webs 402 in which theconductive surfaces 403 are multiple or complex in nature.

FIG. 20 illustrates standard extrusion 200 such as that shown in FIGS.15 and 16.

The links of the present invention may be terminated into connector andother housings. FIGS. 21-23 illustrate one termination interface as asomewhat conical endcap which has a hollow body 501 with a centralopenings 502. The body may support a pair of terminals 504 that matewith the conductive surfaces 52 of the dielectric body 51. The endcap500 may be inserted into various openings in connector housings and assuch, preferably includes a conical insertion end 510.

FIG. 24 illustrates the endcaps 500 in place on a series of links 520that are terminated to an endblock 521 that has surface mount terminals522.

FIG. 25 illustrates an alternate construction of an end block 570. Inthis arrangement, the transmission lines, or links 571, are formed froma dielectric and include a pair of conductive extents 572 formed ontheir exterior surfaces (with the extents 572 shown only on one side forclarity and their corresponding extents being formed on the surfaces ofthe links 571 that face the plane of the paper of FIG. 25). Theseconductive extents 572 are connected to traces 573 on a circuit board574 by way of conductive vias 575 formed on the interior of the circuitboard 574. Such vias may also be constructed within the body of the endblock 570, if desired. The vias 575 are split and their two conductivesections are separated by an intervening gap 576 to maintain separationof the two conductive transmission channels at the level of the board.

FIG. 26 illustrates an end cap 600 mounted to a printed circuit board601. This style of end cap 600 serves as a connector and thus includes ahousing 602, with a central slot 603 with various key ways 604 thataccept projecting portions of the transmission link. The end capconnector 600 may have a plurality of windows 620 for access tosoldering the conductive tail portions 606 of the contacts 607. Ininstances of surface mount tails, the tails may have their horizontalparts 609 tucked under the body of the endcap housing to reduce thecircuit board pad size needed, as well as the capacitance of the systemat the circuit board.

FIG. 27A illustrates a skeletal view of the endcap connector 600 andshows how the contacts, or terminals 607 are supported within and extendthrough the connector housing 602. The terminals 607 may include a dualwire contact end 608 for redundancy in contact (and for providing aparallel electrical path) and the connector 600 may include a couplingstaple 615 that has an inverted U-shape and which enhances coupling ofthe terminals across the housing. The tail portion of these dual wireterminals 607 enhance the stability of the connector. In this regard, italso provides control for the terminals that constitute a channel(laterally) across the housing slot 601. FIG. 27B is a view of theinterior contact assembly that is used in the endcap connector 600. Theterminals 607 are arranged on opposite sides of the connector and aremounted within respective support blocks 610. These support blocks 610are spaced apart from each other a preselected distance that assists inspacing the terminal contacts 608 apart. A coupling staple 615 having anoverall U-shape, or blade shape, may be provided and may be interposedbetween the terminals 607 and support blocks 610 to enhance the couplingbetween and among the terminals 607. FIG. 28 is an end view of theconnector 600.

FIGS. 29A-C illustrate another embodiment of a transmission channel linkconstructed in accordance with the principles of the present inventionutilizing air as the dielectric and utilizing broadside coupling betweenconductive elements. In FIG. 29A, a dielectric substrate 700 is providedof generally uniform cross-section has body portions 701 formed atintervals thereon, with conductive elements 702 disposed on oppositesurfaces of the substrate 700. In this regard, vertical signal channelsare thereby defined in this arrangement, which are identified in theboxes appearing below each of the bodies 701 in FIG. 29A. The polarityof the conductive elements 702 may be arranged to provide fordifferential signal transmission, and as illustrated, one sucharrangement locates the positive (“+”) signal conductive surfaces on oneside and the negative (“−”) conductive surfaces on the other side of thedielectric substrate. As will be understood in the art, the oppositepolarity conductive extents 702 will constitute pairs or signalchannels, that are shown labeled from “1 ” to “4” underneath FIG. 29A.In this embodiment, the opposite conductive pairs are separated by thevolume and extent of the intervening and supporting dielectricsubstrate. This construction is suitable for mezzanine configurations.

FIG. 29B illustrates a variation in the structure of such a connectorwith a dielectric body or substrate 700′ having a plurality of slots705′ formed therein that are spaced apart from each other along thewidth of the substrate. Conductive surfaces 702′ are disposed on thefacing sides (or sidewalls) of the slots and are spaced apart from eachby an intervening gap, which is filled with air. In this structure, thepolarity of the conductive surfaces may be chosen as shown to havenegative and positive signal conductive surfaces facing each other,thereby utilizing the air on the slot 705′ as the dielectric between theassociated pairs of conductive surfaces. Whereas in the embodiment ofFIG. 29A, the signal pairs or channels were arranged vertically, orthrough the dielectric body, in the embodiment of FIGS. 29B and 29C, thearrangement and electrical affinity between the two conductive surfacesthereof is horizontally and extends across through an intervening airgap. In constructing transmission channels of this sort, the entireexterior surface of the substrate may be plated and the upper exteriorsurfaces 706′ may be etched to remove their plating. Any plating that isinitially present in the base 708′ between the two sidewalls may beremoved, such as by etching it away. As a result, a plurality ofconductively disassociated vertical plates 702′ are formed. In this typeof arrangement, the primary field coupling occurs between oppositelycharged pairs of conductive surfaces (horizontally in FIG. 29B), and theair gaps, or spacings, are tighter between the oppositely charged pairsof conductive surfaces than is the spacing between the gaps themselves.Thus, the differential pair spacing is “electrically” tighter by way ofgeometric control to ensure that the primary electrical affinity remainswithin the differential pair. The spacing and the contour of theseconductive surfaces may be controlled by molding the connector andplating the desired surfaces in order to maintain an appropriate size ofthe connector.

FIG. 29C illustrates a similar structure, but one which utilizes aconductive ground plane 710′ applied to the lower surface of thedielectric substrate 700′.

Such structures may be used to form dense matrices of transmissionchannel links as is illustrated in FIG. 30 wherein a plurality ofsubstrates 700′ are stacked together on their side. Each substrate mayinclude a ground plane 710′ and three communication or signal lanes, asillustrated or other arrangements may be chosen.

FIG. 31 illustrates the use of such a structure within a right anglecontext, with a dielectric block 800 with a plurality of grooves 804formed therein. The opposite walls of the grooves 804 may be plated withconductive surfaces 803 that extend from one end 806 to a bellmouth 802at the other end 807. The conductive surfaces 803 end short of thebellmouths 802 to electrically decouple the channel from the nexttransmission channel link section.

FIGS. 32-34 illustrate another construction of a waveguide mediaconstructed in accordance with the principles of the present invention.As shown in FIG. 32, a dielectric substrate 900 is provided with aplurality of slots 902 formed thereon. The slots 902 are formed inopposing surfaces of the dielectric body 904 to define a series ofraised lands that support plated or otherwise conductive surfaces 903.The slots 902 may be considered as forming a series of thin webs thatreduce the cross-section of the dielectric and reduce capacitivecoupling between alternate channels. The width of the conductive surfacemay be controlled within each signal channel or lane in order to controlthe impedance of the channels. As shown best in FIG. 34, surface mountmembers, such as feet 910 may be formed with the substrate and mayinclude the conductive surfaces disposed on their exterior surfaces inorder to establish a conductive interface for connecting with a circuitboard, such as by soldering.

FIG. 35 illustrates a transmission line 420 of the invention thatextends between two circuit boards 421, 422. The transmission line 420mates with a connector 424, similar to the type shown in FIG. 26 andextends outwardly therefrom to a surface mount connection arrangement425 disposed on the circuit board 422 (or formed as surface mounting“feet” that are molded or otherwise formed with the transmission linethat may be attached to opposing contact pads or traces on the surfaceof the circuit board 422). Such a connection may include a plurality ofcontact members 426 that extend upwardly from the surface 427 and thecontact members preferably includes conductive surfaces 428 that arearranged in opposition to the conductive strips 430 so that they willmake direct contact with the strips 430 of the transmission element.They may be soldered, or otherwise attached or may rely solely uponfrictional contact to make an electrical connection. The arrangementillustrated also includes an exterior protective jacket 431 formed of aplastic or metal (provided that the interior side thereof which opposesthe transmission element is protected with an insulator) to protect thetransmission channel from damage and exterior contact.

In FIG. 36, the transmission link 420 is illustrated in a right angleconfiguration extending between two circuit boards. The transmissionlink may be molded into such a shape with the desired physicaldimensions of thickness, spacing, etc. so as to maintain the waveguideparameter through the turning radius. In the application shown, thetransmission link interconnects a surface mount connector 424 with acircuit board 427 by way of a surface mount arrangement 425 directlypositioned on the surface of board 427.

FIGS. 37 and 38 illustrate another embodiment of a grouped elementchannel transmission line, or link 650, that is particularly suitablefor carrying high voltages and currents at high density contactspacings. The body of the transmission line 650 is formed from adielectric and it has a series of grooves, or slots 651, formed thereinthat extend into the body portion thereof from one surface 652 thereof.The sidewalls 654 of these slots are conductively coated with aconductive material, such as by plating, and in effect define a seriesof “plates” 655 that are opposed to each other and are separated by theintervening space, or air, that will typically occupy the slots 651. Inthe left of FIGS. 37 and 38, an insert molded plug 658 is shown and thisplug includes a cap portion 659 and one or more tongues, or fillers 660that depend from the cap portion 659 and which extend into andcompletely occupy the space of the slots 651. A ground plane 659 may bedeposited on the lower surface of the transmission line of FIGS. 37 & 38to provide increased capacitive coupling.

In this manner, and as shown best schematically in FIG. 38, the opposedpolarity (i.e., “+” or “−”) conductive pairs of contacts areelectrically isolated from each other, but nevertheless define acomplete circuit. The sizes involved with the transmission elements ofthe present invention permit very high densities to be achieved with alow inductance delivery mode, especially due to the large number ofcommon parallel current paths. To the right of FIGS. 37 and 38 is shownanother means for accomplishing this isolation, namely the use of aconformal coating that conforms to the overall slot and landconfiguration but which provides electrical insulation or isolationbetween the two conductive surfaces. The use of opposed pairs in thetransmission lines, over which is traversed current across and possiblyon two opposing surfaces thereof, will lead to a lower loop inductanceof the transmission line system.

As shown in FIG. 39, the transmission lines of the present invention mayalso be used to conduct power at very low impedance. In the transmissionline 750 illustrated, a dielectric body portion 751 is provided with aseries of grooves 752 formed in its outer surfaces 753. In a departurefrom some of the previous embodiments, more than just the exteriorsurfaces of the land portions of the dielectric body are plated with aconductive material. Two such lands 755 are continuously plated for thelength of the transmission line 750 and they are interconnected byplating in the groove, or trough 752, that separates them, so that fivedistinct surfaces are plated. These include the two lands 755, the twosidewalls 756 of the grooves 752 and the base 757 of the groove, whichall cooperate to form a single power terminal of the transmission line.In this arrangement there is an increased surface area which willprovide an increased capacitance between the power terminal and anassociated ground terminal. The low inductance and increased capacitancewill serve to lower the impedance of the overall system, so that thetransmission lines of the present invention may be used for lowimpedance power delivery.

FIGS. 40 & 41 illustrate possible executions of the use of a mixedsignal and power transmission line. In FIG. 40, it can be seen that thetransmission line 950 has two signal traces, or extents 951 and asingle, wide power trace, or extent 952 formed on at least one, andpreferably both (opposing) surfaces 955 of the transmission line. Thepower extents define a large power channel with an enlarged continuousconductor for increased current handling and high capacitance with theenlarged plate areas. The power and signal regions of this type ofstructure may be separated by a wide “isolation” region 956 that ismolded or formed as part of the transmission line. In manufacturingprocesses such as extrusion, the tolerances and dimensions of theisolation region may be controlled with high reliability to obtain themaximum electrical benefit and minimize cross-contamination or shortingcontact between the power and signal extents.

FIG. 41 illustrates a similar structure except that the power regionincludes a plurality of power extents 952 a that are separated byintervening isolation regions.

FIGS. 42-50 illustrate a pedestal-type arrangement which incorporatesthe principles of the present invention, and is preferably intended foruse in applications where a transition is required between two levels.In FIG. 42, the pedestal-style connector as illustrated takes the formof a frame, generally designated 1000, for a grouped element channellink (GECL) connector. The frame 1000 has a plurality of raised rib-likeelements running in generally parallel relationship along the contouredsurfaces thereof. Frame 1000 may be described as being elongated in thelongitudinal direction of the rib-like elements, as compared to thewidth of frame 1000. A first group of raised elements 1006 runs from oneside of an aperture 1008 disposed in a base portion 1010 of the frame1000, and runs up a front side of a generally vertical portion 1012, andthen runs across the top side of a top portion 1014, and further wrapsaround a back end 1016 (FIG. 45) of frame 1000, and finally terminateson the underside of top portion 1014 in the vicinity of a pair ofcentering and support pins 1018 and 1020 (FIG. 50). The generalconfiguration of this frame is similar to an S-shape and it provides atorturous path between two levels in which the transmission linessupported on the frame change direction at least once.

A second group of raised elements 1022 runs from an opposite side ofaperture 1008, wraps around a front edge 1024 of the frame 1000, runsalong the underside of base portion 1010, runs up the backside ofvertical portion 1012, then runs along the underside of top portion1014, and also terminates on the underside of top portion 1014 in thevicinity of the centering and support pins 1018 and 1020, but short ofthe terminal ends of first group of raised elements 1006. Thus, frame1000 provides two groups of raised elements 1006 and 1022 that run inopposite directions from near aperture 1008 on the top side of baseportion 1010 to the underside of top portion 1014 of frame 1000. As seenin FIG. 50, the raised elements 1006 and 1022, including the terminalends thereof, may be in staggered relationship to each other, ratherthan in aligned relationship. Terminal ends 1028 of raised elements 1006and terminal ends 1030 of raised elements 1022 may also be arranged inparallel rows, and may also project from the underside surface of topportion 1014 for suitable surface mount to, and for electrical contactwith a corresponding conductive pattern on a printed circuit board orthe like.

The frame 1000 is preferably formed with at least one bend so that theconductive traces will make at least one change of direction in theirextent therealong. In the illustrated embodiment of frame 1000, and asseen in the side view of FIG. 43, frame 1000 may be provided with twoapproximately 90° bends 1002 and 1004 to accommodate positionaltranslation of electronic signals between different vertical positions,as well as between different horizontal positions. Of course, the bends1002 and 1004 may be provided at any desired angle. For example, bends1002 and 1004 could be less than, or more than, 90° and achieve thedesired results. These bends in effect define a torturous path for theconductors and permit the connectors of the present invention to be usedin applications in order to interconnect together circuits at twodifferent levels within an electronic device, such as a server or routeror the like.

The frame 1000 may be formed from a catalyzed resin, such as a liquidcrystal polymer (LCP), by known molding techniques. The frame 1000 maythen be over-molded, such as with a non-catalyzed resin, to provide theGECL connector illustrated in FIG. 51. In the over-molding process,certain features of frame 1000 are left exposed, such as the topsurfaces of raised elements 1006 and 1022. Such exposed features canthen be plated with a metal, such as for example with by an electrolessplating process to form electrical conductors along the top surfaces ofthe raised elements 1006 and 1022. Of course, the over-molding processmay be reversed with a non-catalyzed resin being molded first, and acatalyzed resin then molded to form traces for the metal plating of thedesired conductors. A third technique is to mold the connector and thenselect the areas for metallization with a laser or with lithographictechniques. The connector may be molded as a single piece and theplating applied thereto either selectively or grossly and then etchedaway.

A pair of apertures that are defined in the base portion 1010 may beutilized, if desired, in the over-molding process to position or indexframe 1000 during the molding process. Disposed between each raisedelement 1006 and 1022 is a recess or channel, such as channels 1026shown in FIG. 50. The aperture 1008, also defined in the base portion1010, will enhance the flow of the resin about the frame 1000, includingfilling of recesses or channels 1026 with resin to electrically insulatethe metallization formed on the plurality of separate raised elements1006 and 1022 to provide separate electrical conductors thereon.

In accordance with one aspect of the present invention, at least some ofthe channels disposed between raised elements 1006 and/or 1022 are ofgreater depth than channels 1026. For example, in FIG. 48, threechannels 1032 are provided with greater depth. Channels 1032 are notfilled with resin during the over-molding process. Thus, during theelectroless metallization plating process, channels 1032 also havemetallization formed on the sidewalls 1036 of channels 1032 to formmetal conductors in the channels 1032. This can best be seen in FIG. 50where metallization is formed on the sidewalls 1036 of three pairs ofthe raised ribs 1006 that form three channels 1032. The thickness of themetallization in FIG. 50 is enlarged for illustration purposes. Thesemetallized channels 1032 are also shown in FIG. 46. Any metallizationformed in the bottoms of channels 1032 can be removed by knowntechniques to provide two separate and opposed electrical conductors onthe sidewalls 1036 in each channel 1032. Since channels 1032 are notover-molded, there is air dielectric between the metal sidewalls 1036.The channels 1032 with the plated sidewalls act as a transmission linefor high frequency signals therein. For example, high speed differentialelectronic signals, such as about +5 volts and −5 volts, at frequenciesof 10 Gigabits or higher, may be conducted along the opposed metallizedsidewalls 1036. In this respect, the channels 1032 also act aswaveguides which extend for the length of the transmission line that isdefined by the two conductive trace portions. The intervening air gaphas a dielectric constant of approximately or equal to 1.0 whichenhances coupling between the two conductors.

With continuing reference to FIG. 50, other raised ribs 1038 of the setof raised elements 1006 have adjacent channels filled during theover-molding process such that only the top surface of ribs 1038 becomeplated with metal to form conductors during the plating process.Preferably, at least one of the ribs 1038 is disposed between the highfrequency transmission lines formed in each of channels 1032. In use,the conductors formed on ribs 1038 are preferably used for low impedancesources, such as ground and power, to provide affinity for thedifferential signals in the transmission lines in channels 1032. To thisend, it is further preferable to dispose a low impedance conductor onribs 1038 a at both sides of the channels 1032. Thus, a preferredassignment of the conductors formed on the raised ribs 1038 and 1038 aand in channel elements 1032 across frame 1000 and across thecorresponding connector 1050 is, for example, ground, differentialsignal pair, power, differential signal pair, ground, differentialsignal pair and power. Of course, assignment of the ground or powerconductors 1038 or 1038 a may be changed since any power sources areconsidered to be low impedance, and similar in impedance to ground.

It may be noted that the raised elements 1022 are not provided with anychannels 1032 in the embodiment shown in FIGS. 48 and 50. However, someof the elements 1022 may also be provided with transmission lines inchannels 1032, if desired. In this embodiment it is assumed thatconductors formed on top of elements 1022 may be utilized to conductlower frequency signals, or for additional power and ground lines.

FIG. 51 illustrates a grouped element channel link connector, generallydesignated 1050, after the frame 1000 is over-molded. Various featuresof frame 1000 are shown in phantom lines. Connector 1050 thereforeretains the attributes of frame 1000 such as its elongate shape in thedirection of the raised elements or ribs and one or more bends totranslate signals between vertical as well as horizontal positions.

An alternate embodiment of connector 1050 is generally designated 1060in FIG. 52. Connector 1060 is generally similar to connector 1050 exceptthat channels 1062 that are partially interposed between signal channeltransmission conductive surfaces are wider than the channels 1032 in theconnector 1050. The connector 1060 may typically be a connector thatmates with a circuit card or board edge of a transceiver or adaptermodule that is inserted into and held within a conductive shielding cage1070, 1082. The forward edge at 1022 would support a connector 1062 asshown in FIG. 53, while the rear edge to which the channels 1062 extendwould contact the upper surface of a circuit board 1052. (FIG. 53.) Inthis embodiment of connector 1060, no low impedance conductors, such ason ribs 1038 in FIG. 50, are provided between the transmission linesformed in channels 1062. However, a low impedance conductor may beprovided to either side of channels 1062, such as on ribs 1064. Again,channels 1062 are not filled during the over-molding process, such thatthe sidewalls of channels 1062 are plated with conductive metal duringthe plating process in a manner already described for channels 1032 ofconnector 1050.

An example of the use of the GECL connector 1050, or the alternateembodiment GECL connector 1060, is illustrated in FIGS. 53 and 54. Aprinted circuit board (“PCB”) 1052 may be provided with a plurality ofconnector surface mounting areas 1054, each including a plurality ofelectrical contacts for mating to corresponding contacts on theunderside of connectors 1050 or 1060. Apertures 1056 may be provided atthe mounting areas 1054 to engage the centering and mounting pins 1018and 1020 and align the connector 1050 to PCB 1052.

The card edge connector 1062 has downwardly depending pins 1064 thatmate with apertures 1036 and 1038 in GECL connectors 1050 and 1060. Edgeconnector 1062 has a plurality of contacts on its underside that makeelectrical connection with the metal conductors on the raised elements1006 and 1022 of connectors 1050 and 1060 when attached thereto. Agenerally rectangular opening 1066 is defined in the face of edgeconnector 1062 to receive an edge of a mating connector with a pluralityof electrical contacts. Thus, all, or any select portion, of the signalspresent on the conductors formed on raised elements 1006 and 1022,including the channel elements 1032 and 1062, may be made available atopening 1066 of edge connector 1062.

A connector tray, or shielding cage 1070 may optionally engage PCB 1052and it may be divided into a plurality of chambers; one for eachconnector 1050 or 1060. A plurality of round bosses 1072 defined onsides of connector tray 1070 fit into correspondingly shaped recesses1074 defined in the edges of PCB 1052, and vertically oriented pins 1078on tray 1070 fit into apertures 1080 disposed between the mounting areas1054 to lock tray 1070 to PCB 1052. A lip 1076 of tray 1070 rests on theupper surface of PCB 1052. A plurality of tray, or cage covers 1082, arepreferably provided with downwardly depending pins 1084 which may beinserted in apertures 1086 defined in the connector tray 1070. Connectortray 1070 and tray covers 1082 may be plated with a metal to reduce EMI,RF or other electrical interference about the connectors 1050 and 1060.

Another frame member embodiment is shown in FIG. 55 at 1102. This frame1102 has a plurality of elements 1104 and 1106 (and which are platedwith a conductive material) that are supported on a base portion andwhich extend upwardly therefrom so that they are “raised” with respectto the base. The frame 1102 also has one or more bends, such as at 1108and 1110 in which the conductive traces of the connector make twochanges of direction, for the same reasons and purposes as in theearlier-described frame 1000. Rows of contacts 1112 and 1114 aredisposed at the ends of these elements 1106 and 1104, respectively, areadapted to make contact with corresponding rows of contacts, such as atthe mounting area 1054 on the circuit board 1052 in FIGS. 53 and 54. Thefree ends 1106 of these conductive elements permit another connector tobe soldered to the connector 1100. As seen in FIGS. 55 & 56, the twofree ends are spaced apart from each other in the vertical direction andthey further preferably lie in two different, but generally parallelplanes.

Frame 1002 is adapted to be over-molded into another style of pedestalconnector 1100 that is shown in FIGS. 56-58. At least some channelsbetween the raised elements 1104, as shown in FIG. 56, such as the threechannels 1122, are preferably left open during the over-molding processso that sidewalls of channels 1122 may be metallized to operate aschannel elements or transmission lines, as previously described abovefor connectors 1050 and 1060. This plating with a conductive materialmay also be done prior to the overmolding of the outer portions of theconnector.

The frame member 1102 is formed with an outer portion, preferably overmolded about selected portions thereof and this outer portion has a pairof support walls 1199 that extend vertically as shown in FIG. 56 tocreate a cavity, or receptacle 1200 underneath the one end 1106 andadjacent to the other end so that the pedestal connector mat be placedon a circuit board over another connector. This connector has a greaterwidth of the slots between its sidewalls and these wider channelelements 1124 are otherwise similar in construction, arrangement andoperation to the already described wider channel elements 1062 utilizedin connector 1060 in FIG. 52. Metal plating 1132 is disposed on theopposing sidewalls of channel elements 112. Any metal formed in thebottom of channels 1124 during the metallization process may be removedby various techniques known to the prior art. In the embodiments of thepedestal connector 1100 illustrated in FIGS. 55-58, raised elements 1106are not provided with any narrow or wide channel elements 1122 or 1124,but may be if so desired. A pair of apertures 1128 and 1130 in the topsurface of pedestal connector 1100 is adapted to receive the edgeconnector 1062 shown in FIGS. 53 and 54, in similar fashion and for thesame purposes as described above for connectors 1050 and 1060.

1. (canceled)
 2. (canceled)
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 5. (canceled) 6.(canceled)
 7. (canceled)
 8. (canceled)
 9. (canceled)
 10. (canceled) 11.A frame for an over-molded electrical connector comprising: a framemember formed from a plastic material that may be plated with metal,said frame member being elongated in one direction, said frame memberhaving top and bottom sides; and, a plurality of raised ribs formedalong one of the sides with a channel defined between each pair of ribs,at least one channel being deeper than the remaining channels, said atleast one channel having opposing sidewalls that may be plated withmetal to define a channel element with high-frequency electronic signalcharacteristics, said plurality of ribs and said channel elementdisposed in the elongated direction.
 12. The frame for an over-moldedelectrical connector as claimed in accordance with claim 11, whereinsaid frame member has at least one angular bend across its elongateddirection to interface with and to conduct electronic signals in bothhorizontal and vertical directions.
 13. The frame for an over-moldedelectrical connector as claimed in accordance with claim 12, wherein afirst set of a plurality of raised ribs is formed on the top surface ofthe frame member and a second set of a plurality of raised ribs isformed on the bottom surface of the frame member, a portion of the firstset of raised ribs wrapping around an end of the frame member to thebottom side, and a portion of said second set of raised ribs wrappingaround an opposite end of said frame member to the top side.
 14. Theframe for an over-molded electrical connector as claimed in accordancewith claim 13, wherein a first set of ends of the first and second setof raised ribs meet in a connector area disposed at the bottom side ofthe frame member, and a second set of ends of the first and second setof raised ribs meet in another connector area disposed on the top sideof the frame member.
 15. A process for fabricating a frame for anover-molded connector comprising the steps of: molding a frame memberfrom a plastic material that may be plated with metal, providing atleast one set of raised ribs along one surface of said frame memberduring the molding of the frame member with a plurality of channelsdisposed between said raised ribs with at least one channel of greaterdepth than the remaining channels; and, providing at least one angularbend in said raised ribs, said channels and said frame member.
 16. Aprocess for fabricating an over-molded connector comprising the stepsof: molding a frame member from a plastic material that may be platedwith metal, providing at least one set of raised ribs along one surfaceof said frame member during the molding of the frame member with aplurality of channels disposed between said raised ribs with at leastone channel of greater depth than the remaining channels; providing atleast one angular bend in said raised ribs, said channels and said framemember; selectively over-molding said frame member with an electricallyinsulative compound to leave the plurality of ribs exposed on the topsurface, to leave said at least one deeper channel exposed, but to fillthe remaining channels with the electrically insulative compound toelectrically insulate the exposed top surfaces of the ribs from eachother; plating the exposed top surfaces of said ribs with metal toprovide electrical conductors thereon; and, plating the sidewalls ofsaid at least one deeper channel with metal to provide at least onechannel element with high frequency signal characteristics.